Tempering & drying

During the subsequent soldering process, moisture trapped in the circuit board or components can evaporate suddenly when exposed to heat. The result: delamination (separation of layers), cracks in the material, or the dreaded “popcorn effect,” in which the casings of SMD components literally burst open due to vapor pressure. Such damage is not only frustrating, it also leads to malfunctions, rework, or, in the worst case, the complete failure of entire assemblies.

To effectively prevent these risks, we rely on professional drying directly before processing. In this process, we remove the moisture trapped in the circuit boards and components—gently, efficiently, and reliably. Depending on the material, prior treatment, and sensitivity, we also operate under vacuum conditions to achieve optimal results.

We use high-quality Heraeus and Memmert drying ovens, which are specifically designed to meet the requirements of electronics manufacturing. They ensure consistent temperatures, reproducible processes, and the reliable removal of moisture—even for complex assemblies.

The MSL storage cabinet enables the safe, ESD-compliant storage of SMD components, reels, trays, as well as flux and rework materials under controlled temperature and humidity conditions. With an antistatic interior, clear labeling, and digital inventory management, it ensures organization and traceability. Access control, locked doors, and alarm monitoring enhance security, while standardized container sizes, a FIFO system, and climate monitoring support efficient processes. The stable, climate-controlled cabinet with optional LED lighting reliably protects components and meets IPC and ISO requirements.