Quantec SERVICES GmbH
Selective potting
Customized protection for sensitive circuit board areas
Our high-precision injection system allows us to selectively coat individual components or areas of circuit boards with silicone, synthetic resin (epoxy), or polyurethane (PU), customized to the customer’s specific requirements. Using processes such as Dam & Fill or Glob Top, we reliably protect only the desired areas without wetting the surrounding surfaces.
Selective potting offers numerous advantages:
- Extended service life of the assembly thanks to protection against moisture, dust, chemicals, and mechanical stress
- Electrical insulation and optimized thermal management to dissipate heat generated
- High precision thanks to computer-controlled dispensing technology, which enables application without air bubbles
- Material flexibility – from elastic, vibration-damping silicones to high-strength epoxy resins
Our processes guarantee consistent quality, short cycle times, and optimal curing conditions—ensuring maximum reliability in every application, from prototyping to series production.

Selective processes such as “Dam & Fill” or “Glob Top”
In the Dam & Fill process, a barrier (dam) made of a viscous material is first constructed around the area to be protected, which is then filled with a liquid filling compound. This allows for precise coverage of sensitive areas.
With the Glob Top method, a viscous drop of sealing compound is applied directly to a single component (e.g., a chip or wire bond), securely encapsulating it. Both methods protect only the desired areas without wetting other parts of the PCB.
Flexible material options
Depending on customer requirements, a variety of materials are available:
Technical and regulatory aspects and advantages
Quantec Services GmbH
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