Quantec SERVICES GmbH
AXI/MXI X-ray inspection
Quality control for the highest standards
X-ray inspection is an indispensable part of modern electronics manufacturing. It enables the precise analysis of solder joints, components, and PCBs without damaging the product. Especially in the case of highly complex EMS (Electronic Manufacturing Services) assemblies, X-ray inspection ensures that even hidden defects are detected—before they lead to failures.
With its X-ray inspection service for EMS components, Quantec Services GmbH offers its customers a reliable and reproducible method for quality assurance in electronics manufacturing. Our modern testing facility detects defects that remain hidden using conventional methods such as AOI or ICT—such as voids or cavities (holes in solder joints)—and enables rapid root cause analysis directly within the production process.
AXI and MXI – automated and manual X-ray inspection
Two different methods are used in X-ray inspection:
AXI (Automated X-ray Inspection) refers to automated X-ray inspection, in which assemblies are inspected systematically and reproducibly. This method is particularly suitable for series inspections in manufacturing.
MXI (Manual X-ray Inspection), on the other hand, is a manual X-ray inspection process. It is performed by trained specialists and is used for random sampling, defect analysis, or the visual evaluation of individual solder joints. The two methods complete each other perfectly to ensure consistently high quality in electronics manufacturing.
Whether during initial sample inspection, series production or repair processes, X-ray analysis delivers clear, reliable results and builds confidence in the quality of your products. This helps you to ensure the long-term reliability of your manufacturing processes and avoid high-cost rework.
X-ray inspection using the Nordson DAGE™ Quadra 3
With the acquisition of the Nordson DAGE™ Quadra 3 X-ray machine, Quantec Services GmbH is expanding its testing facility to include a highly modern process for the damage-free analysis of electronic assemblies.
X-ray technology provides a view into the internal structures of PCBs and components without damaging them. This makes it possible to detect defects that remain hidden with conventional testing methods—such as solder joints under BGAs or QFNs, incomplete through-hole plating (PTH filling), material inclusions, cracks in components, or so-called “head-in-pillow” defects.
The Quadra 3 offers high-resolution imaging with up to 7,500x magnification. Thanks to the Aspire™ FP detector, even the finest details become quickly and clearly visible. Its unique dual-oblique-axis geometry allows every component to be inspected from various angles without having to rotate it.
In addition, the system features automatic measurement and analysis functions, such as void analysis, for evaluating voids or cavities in solder joints. These functions enable reliable evaluation in accordance with IPC standards. With the optional X-Plane® technology, 3D models can also be created, allowing for even more precise examination of complex structures.
With this testing technology, we can:
- reliably analyze hidden solder joints,
- identify and document production defects early on,
- verify the quality of assemblies without destroying them,
- even the smallest defects can be detected in real time.
The Nordson DAGE™ Quadra 3 is therefore a key component for ensuring the highest quality standards and offers our customers additional reliability in the production and testing of electronic assemblies.
