Nitrogen is used as a shielding gas in PCB assembly to prevent oxidation during the soldering process. This results in improved soldering quality, as the solder wets the surface more effectively and less soldering defects occur.
We generate our own nitrogen in-house, thereby adding another green contribution to our production and supporting a positive CO₂ footprint. 
As a result, truck transport is no longer required, and we are also less dependent on suppliers in times of crisis.
Main reasons why nitrogen is used in PCB assembly:
Preventing oxidation:
Oxygen in the air can lead to oxidation of solder joints and components, thereby impairing soldering quality. Nitrogen displaces oxygen and prevents such oxidation.
Improved solder wettability:
Preventing oxidation improves solder wetting, resulting in better and more reliable solder joints.
Reducing soldering defects:
Improved wettability and reduced oxidation result in fewer soldering defects, thereby increasing the quality of PCB assembly.
Reducing solder bath contamination:
Nitrogen helps reduce the formation of dross in the solder bath, which extends the service life of the solder and the soldering tools.
Improved process control:
Nitrogen allows improved control of the soldering process and a wider process window, which is especially beneficial for the assembly of complex designs.
